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 DISCRETE SEMICONDUCTORS
DATA SHEET
PSMN005-25D N-channel logic level TrenchMOS(TM) transistor
Product specification October 1999
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS(TM) transistor
FEATURES
* 'Trench' technology * Very low on-state resistance * Fast switching * Logic level compatible
g
PSMN005-25D
QUICK REFERENCE DATA
SYMBOL
d
VDSS = 25 V ID = 75 A RDS(ON) 5.8 m (VGS = 10 V) RDS(ON) 7.5 m (VGS = 5 V)
s
GENERAL DESCRIPTION
SiliconMAX products use the latest Philips Trench technology to achieve the lowest possible on-state resistance in each package at each voltage rating. Applications:* d.c. to d.c. converters * switched mode power supplies The PSMN005-25D is supplied in the SOT428 (Dpak) surface mounting package.
PINNING
PIN 1 2 3 tab gate drain1 source DESCRIPTION
SOT428 (DPAK)
tab
2
drain
1
3
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER VDSS VDGR VGS VGSM ID IDM PD Tj, Tstg Drain-source voltage Drain-gate voltage Continuous gate-source voltage Peak pulsed gate-source voltage Continuous drain current Pulsed drain current Total power dissipation Operating junction and storage temperature CONDITIONS Tj = 25 C to 175C Tj = 25 C to 175C; RGS = 20 k Tj 150 C Tmb = 25 C; VGS = 5 V Tmb = 100 C; VGS = 5 V Tmb = 25 C Tmb = 25 C MIN. - 55 MAX. 25 25 15 20 752 70 240 125 175 UNIT V V V V A A A W C
1 It is not possible to make connection to pin 2 of the SOT428 package. 2 Continuous current rating limited by package.
October 1999
2
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS(TM) transistor
AVALANCHE ENERGY LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER EAS IAS Non-repetitive avalanche energy Non-repetitive avalanche current CONDITIONS Unclamped inductive load, IAS = 75 A; tp = 100 s; Tj prior to avalanche = 25C; VDD 15 V; RGS = 50 ; VGS = 5 V
PSMN005-25D
MIN. -
MAX. 120 75
UNIT mJ A
THERMAL RESISTANCES
SYMBOL PARAMETER Rth j-mb Rth j-a Thermal resistance junction to mounting base Thermal resistance junction to ambient CONDITIONS MIN. SOT428 package, pcb mounted, minimum footprint TYP. MAX. UNIT 50 1.2 K/W K/W
ELECTRICAL CHARACTERISTICS
Tj= 25C unless otherwise specified SYMBOL PARAMETER V(BR)DSS VGS(TO) RDS(ON) IGSS IDSS Qg(tot) Qgs Qgd td on tr td off tf Ld Ls Ciss Coss Crss Drain-source breakdown voltage Gate threshold voltage Drain-source on-state resistance CONDITIONS VGS = 0 V; ID = 0.25 mA; Tj = -55C VDS = VGS; ID = 1 mA Tj = 175C Tj = -55C VGS = 10 V; ID = 25 A VGS = 5 V; ID = 25 A VGS = 5 V; ID = 25 A; Tj = 175C Gate source leakage current VGS = 10 V; VDS = 0 V Zero gate voltage drain VDS = 25 V; VGS = 0 V; current Tj = 175C Total gate charge Gate-source charge Gate-drain (Miller) charge Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time Internal drain inductance Internal source inductance Input capacitance Output capacitance Feedback capacitance ID = 75 A; VDD = 15 V; VGS = 5 V MIN. 25 23 1 0.5 TYP. MAX. UNIT 1.5 5 6.2 0.02 0.05 60 8 32 21 170 270 216 3.5 7.5 3500 970 640 2 2.3 5.8 7.5 14 100 10 500 V V V V V m m m nA A A nC nC nC ns ns ns ns nH nH pF pF pF
VDD = 15 V; RD = 0.6 ; VGS = 10 V; RG = 10 Resistive load Measured tab to centre of die Measured from source lead to source bond pad VGS = 0 V; VDS = 20 V; f = 1 MHz
October 1999
3
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS(TM) transistor
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
Tj = 25C unless otherwise specified SYMBOL PARAMETER IS ISM VSD trr Qrr CONDITIONS
PSMN005-25D
MIN. -
TYP. MAX. UNIT 0.95 140 0.27 75 240 1.2 A A V ns C
Continuous source current (body diode) Pulsed source current (body diode) Diode forward voltage IF = 25 A; VGS = 0 V Reverse recovery time Reverse recovery charge IF = 25 A; -dIF/dt = 100 A/s; VGS = 0 V; VR = 25 V
October 1999
4
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS(TM) transistor
PSMN005-25D
Normalised Power Derating, PD (%) 100 90 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 Mounting Base temperature, Tmb (C) 175
10
Transient thermal impedance, Zth j-mb (K/W)
1
D = 0.5 0.2
0.1
0.1 0.05 0.02 P D tp D = tp/T
0.01 single pulse T 0.001 1E-06 1E-05 1E-04 1E-03 1E-02 1E-01 1E+00
Pulse width, tp (s)
Fig.1. Normalised power dissipation. PD% = 100PD/PD 25 C = f(Tmb)
Fig.4. Transient thermal impedance. Zth j-mb = f(t); parameter D = tp/T
Drain Current, ID (A) 3V VGS = 2.8 V 10V 5V
Normalised Current Derating, ID (%) 100 90 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 Mounting Base temperature, Tmb (C) 150 175
50 45 40 35 30 25 20 15 10
Tj = 25 C 2.6 V
2.4 V
2.2 V 2V
5 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Drain-Source Voltage, VDS (V) 1.6 1.8 2
Fig.2. Normalised continuous drain current. ID% = 100ID/ID 25 C = f(Tmb); conditions: VGS 5 V
Peak Pulsed Drain Current, IDM (A) RDS(on) = VDS/ ID tp = 10 us
Fig.5. Typical output characteristics, Tj = 25 C. ID = f(VDS)
1000
0.03 0.025
Drain-Source On Resistance, RDS(on) (Ohms) 2.2 V 2.4 V 2.6 V Tj = 25 C
100
100 us 0.02 1 ms 0.015 2.8 V 3V 0.01 5V 0.005 VGS = 10V D.C. 10 ms 100 ms
10
1 1 10 Drain-Source Voltage, VDS (V) 100
0 0 5 10 15 20 25 30 Drain Current, ID (A) 35 40 45 50
Fig.3. Safe operating area. Tmb = 25 C ID & IDM = f(VDS); IDM single pulse; parameter tp
Fig.6. Typical on-state resistance, Tj = 25 C. RDS(ON) = f(ID)
October 1999
5
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS(TM) transistor
PSMN005-25D
Drain current, ID (A) 50 45 40 35 30 25 20 15 10 5 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 Gate-source voltage, VGS (V) Tj = 25 C 175 C VDS > ID X RDS(ON)
Threshold Voltage, VGS(TO) (V) 2.25 2 1.75 1.5 typical 1.25 1 0.75 0.5 0.25 0 -60 -40 -20 0 20 40 60 80 100 120 140 160 180 Junction Temperature, Tj (C) minimum maximum
Fig.7. Typical transfer characteristics. ID = f(VGS)
Transconductance, gfs (S) VDS > ID X RDS(ON) Tj = 25 C
Fig.10. Gate threshold voltage. VGS(TO) = f(Tj); conditions: ID = 1 mA; VDS = VGS
Drain current, ID (A) VDS = 5 V 1.0E-02
80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0
1.0E-01
175 C
1.0E-03 minimum 1.0E-04 typical maximum
1.0E-05
1.0E-06
0
5
10
15
20 25 30 35 Drain current, ID (A)
40
45
50
0
0.5
1 1.5 2 Gate-source voltage, VGS (V)
2.5
3
Fig.8. Typical transconductance, Tj = 25 C. gfs = f(ID)
Normalised On-state Resistance
Fig.11. Sub-threshold drain current. ID = f(VGS); conditions: Tj = 25 C; VDS = VGS
2 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0
10000
Capacitances, Ciss, Coss, Crss (pF)
Ciss
1000
Coss Crss
100
-60 -40 -20 0 20 40 60 80 100 Junction temperature, Tj (C) 120 140 160 180
0.1
1 10 Drain-Source Voltage, VDS (V)
100
Fig.9. Normalised drain-source on-state resistance. RDS(ON)/RDS(ON)25 C = f(Tj)
Fig.12. Typical capacitances, Ciss, Coss, Crss. C = f(VDS); conditions: VGS = 0 V; f = 1 MHz
October 1999
6
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS(TM) transistor
PSMN005-25D
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Gate-source voltage, VGS (V) ID = 75 A VDD = 15 V Tj = 25 C 100
Maximum Avalanche Current, IAS (A)
25 C
10
Tj prior to avalanche = 150 C
0
10
20
30
40 50 60 70 Gate charge, QG (nC)
80
90
100
110
1 0.001
0.01
0.1 Avalanche time, tAV (ms)
1
10
Fig.13. Typical turn-on gate-charge characteristics. VGS = f(QG)
Fig.15. Maximum permissible non-repetitive avalanche current (IAS) versus avalanche time (tAV); unclamped inductive load
Source-Drain Diode Current, IF (A) 50 45 40 35 30 25 20 15 10 5 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 Source-Drain Voltage, VSDS (V) 175 C Tj = 25 C VGS = 0 V
Fig.14. Typical reverse diode current. IF = f(VSDS); conditions: VGS = 0 V; parameter Tj
October 1999
7
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS(TM) transistor
MECHANICAL DATA
Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads (one lead cropped)
PSMN005-25D
SOT428
seating plane y A E b2 A A1 mounting base A2 D1
E1 D HE L2
2
L L1
1
b1 e e1 b
3
wM A c
0
10 scale
20 mm
DIMENSIONS (mm are the original dimensions) A UNIT max. A1(1) mm 2.38 2.22 0.65 0.45 A2 0.89 0.71 b 0.89 0.71 b1 max. 1.1 0.9 b2 5.36 5.26 c 0.4 0.2 D1 E D max. max. max. 6.22 5.98 4.81 4.45 6.73 6.47 E1 min. 4.0 e e1 HE max. 10.4 9.6 L 2.95 2.55 L1 min. 0.5 L2 0.7 0.5 w 0.2 y max. 0.2
2.285 4.57
Note 1. Measured from heatsink back to lead. OUTLINE VERSION SOT428 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 98-04-07
Fig.16. SOT428 surface mounting package. Centre pin connected to mounting base.
Notes 1. This product is supplied in anti-static packaging. The gate-source input must be protected against static discharge during transport or handling. 2. Refer to SMD Footprint Design and Soldering Guidelines, Data Handbook SC18. 3. Epoxy meets UL94 V0 at 1/8".
October 1999
8
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS(TM) transistor
MOUNTING INSTRUCTIONS
Dimensions in mm
7.0
PSMN005-25D
7.0
2.15 2.5
1.5
4.57
Fig.17. SOT428 : soldering pattern for surface mounting.
October 1999
9
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS(TM) transistor
DEFINITIONS
Data sheet status Objective specification Product specification Limiting values
PSMN005-25D
This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1999 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
October 1999
10
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS(TM) transistor
NOTES
PSMN005-25D
October 1999
11
Rev 1.100
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 69
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
603502/300/05/pp12
Date of release: October
1999
Document order number:
9397 750 06977


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